I-Connect007 Magazine

I007-Feb2026

IPC International Community magazine an association member publication

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74 I-CONNECT007 MAGAZINE I FEBRUARY 2026 F E AT U R E A RT I C L E BY M I C H E L L E T E , I - C O N N ECT0 07 Big Ideas Take the Stage APEX EXPO 2026 Keynotes S ome of the most consequential conversa- tions in electronics manufacturing will take center stage at APEX EXPO 2026, with a keynote lineup that spans quantum computing, advanced packaging, artificial intelligence, and the global electronics economy. From IBM and Intel technologists to an AI futur- ist and a global industry leader, this year's keynote speakers will offer attendees both technical depth and strategic perspective on the forces reshaping the electronics ecosystem. Quantum Computing Takes Center Stage Dr. David Lokken-Toyli When: Monday, March 16 | 1:30–2:30 p.m. Session: "Computing at the Quantum Advan- tage Frontier" (Conference Keynote; registra- tion required) David Lokken-Toyli, a principal research scien- tist at IBM Quantum, opens the conference speak- ing on one of the hottest topics in technology: the trajectory from today's quantum prototypes toward large-scale, error-corrected quantum systems. His keynote will frame IBM's hardware roadmap and highlight why quantum computing matters to the broader electronics ecosystem, especially how hardware advances create new opportunities for component and subsystem suppliers. Attendees can expect insights on emerging quantum work- flows and where electronic manufacturing fits into future quantum supply chains. Packaging Innovation and Integration Dr. Ravi Mahajan When: Monday, March 16 | 2:30–3:30 p.m. Session: "Advanced Packaging: A Crucial Enabler for Heterogeneous Integration" (Conference Keynote; registration required) Following the quantum keynote, Dr. Ravi Mahajan, Intel Fellow and director of Assembly & Packag- Dr. David Lokken-Toyli Dr. Ravi Mahajan Zack Kass Dr. John W. Mitchell

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