IPC International Community magazine an association member publication
Issue link: https://iconnect007.uberflip.com/i/1543307
84 I-CONNECT007 MAGAZINE I FEBRUARY 2026 Are You Ready for APEX EXPO 2026? D E S I G N E R S N OT E B O O K BY VERN SOLBERG, CONSULTANT F or over 25 years, the APEX EXPO Techni- cal Conference has been a trusted forum for showcasing breakthrough research, fos- tering engineering collaboration, and advancing innovation across electronics manufacturing. It's recognized as the premier event for the electron- ics industry. The emphasis of this year's event will have an advanced electronic packaging focus, particularly component-to-system-level integration. Global leaders in electronics manufacturing will gather to explore the technologies and trends shaping the future of advanced packaging. On Monday, March 16, a session on next-gener- ation semiconductor packaging highlights how advanced packaging enables AI, high-performance

