IPC International Community magazine an association member publication
Issue link: https://iconnect007.uberflip.com/i/1543307
86 I-CONNECT007 MAGAZINE I FEBRUARY 2026 computing, quantum systems, and heterogeneous integration. The technical sessions continue Tues- day and Wednesday with more than 80 original, unpublished technical papers. Topics range from advanced semiconductor packaging and PCB fabrication to power elec- tronics, materials and processes, reliability, and test with attention on sustainability, AI and factory automation, and next-generation assembly tech- nologies. For those interested in IPC standards, standards development meetings take place throughout the week, beginning Saturday, March 14 with a dedicated Task Group maintaining the Joint Industry Soldering Standard, IPC-J-STD-001, and IPC-A-610, Acceptability of Electronic Assem- blies. Similar task groups will be meeting through- out the following week. To review the task group topics, scheduled meeting times, and place, visit www.electronics.org. Always a highlight of APEX EXPO is the show floor that features the largest gathering of exhibi- tors in North America, representing every step in the electronics manufacturing supply chain. Walk the show floor to meet the industry's lead- ing equipment manufacturers, suppliers, and inno- vators to compare solutions, connect with exist- ing suppliers, and find new partners. Engineering professionals can have face-to-face conversa- tions with OEMs, capital equipment manufactur- ers, material suppliers, and product innovators in design, advanced printed board manufactur- ing, electronics assembly, and test under one roof. The event offers nearly endless opportuni- ties for education, gaining access to cutting-edge technologies, advanced materials, and the latest processes. Attendees will include industry profes- sionals from around the globe, coming together to access the latest technical content as well as participate in the development of IPC standards. Appearances Vern Solberg will be conducting a half-day tutorial on "PCB Design Engineers' Introduction to High Density Semiconductor Package Technologies" at APEX EXPO on Thursday, March 19, where he will address 2D, 2.5D, and 3D system-in-packaging and ultra high- density hybrid bond interconnect. I-CONNECT007 Vern Solberg is a distin- guished member of the Global Electronics Asso- ciation's Hall of Fame and has served as the chair or vice chair in developing a number of technical stan- dards and implementation guideline standards, including the IPC-7090 series that focuses on design for manufacturing and reliability for electronic assem- blies. To read past columns, click here. D E S I G N E R S N OT E B O O K