Issue link: https://iconnect007.uberflip.com/i/1544707
38 SMT007 MAGAZINE I MAY 2026 A RT I C L E The global electronics industry is no strang- er to supply chain disruption, yet memory devices, particularly DRAM and NAND flash, sit at the center of a uniquely persistent challenge. The situ- ation is particularly complex because constraints are not isolated; they are occurring simultaneously across both legacy and next-generation memory technologies. From DDR4 shortages driven by supplier exits to DDR5 demand being pulled by AI infrastructure, the market is facing a perfect storm of reduced supply, shifting demand, and aggressive pricing increases. For OEMs, EMS providers, and high-re- liability sectors, this is a serious operational chal- lenge. This article explores the underlying causes of ongoing memory constraints, the specific risks they introduce, and, most importantly, the practical, engineering-led strategies organizations are using to maintain continuity. Among these approaches, component recovery and reuse are a credible, scalable solution that complements traditional sourcing strategies. Understanding the Nature of Memory Shortages DDR4 and LPDDR4: Structural supply reduc- tion. DDR4 and LPDDR4 are among the most constrained memory categories. A major contrib- uting factor is the exit of leading DRAM manufac- turers from these nodes, which has significantly reduced global production capacity. With fewer suppliers and limited new investment in these technologies, allocation has tightened, leaving many organisations struggling to secure a consis- tent supply. DDR5 and LPDDR5: AI is consuming capacity. While newer technologies like DDR5 and LPDDR5 are still in production, they are far from immune to disruption. Demand has surged due to the rapid expansion of AI-driven infrastructure. This shift is absorbing a disproportionate share of manufactur- ing capacity, leaving other sectors competing for limited availability. Managing DDR4, DDR5, and HBM Supply Challenges BY RO B RO N A N , R E T RO N I X LT D.