Issue link: https://iconnect007.uberflip.com/i/1545666
JULY 2026 I SMT007 MAGAZINE 33 lish, and apply process controls. Requirements include inspection parameters, calibration, detect- ability, resolution, threshold limits, and program setups, measurement system analysis (MSA), maintenance, and verification protocols. The stan- dard establishes generic requirements applicable to automated inspection systems and is intended to be used in conjunction with product/process- specific standards of the IPC-971X series. IPC-9712, Requirements for Automated Inspection Process Control for IC Substrates The IPC-9712 standard provides requirements for automated inspection systems—automated optical inspection (AOI), automated visual inspection (AVI), and metrology—to define, set up, establish, and apply process control for manufacturing integrated chip substrates, including general and specific process and equipment conditions. Requirements include those for operating and inspection parame- ters, vision systems, lighting conditions, calibration, detectability, resolution, threshold limits, process windows, program setups, measurement system analysis (MSA), maintenance, and verification proto- cols, in addition to the generic requirements of IPC-9711. IPC-9716A, Requirements for Automated Inspection Process Control for Printed Board Assembly Processes IPC-9716A provides specific requirements for automated inspection for printed board assembly processes in addition to the generic requirements of IPC-9711. Requirements are based on the use of inspection systems such as solder paste inspection (SPI), automatic optical inspection (AOI), and auto- matic X-ray inspection (AXI). The purpose of IPC-9716A is to set industry- defined requirements for inspection systems to reduce false calls, ensuring quality and reliability while improving throughput and shortening cycle times. This standard also supports electronics manufacturers to enable advanced manufacturing, real-time data analytics, and control capabilities. SMT007