32 SMT007 MAGAZINE I JULY 2026
A RT I C L E BY G LO BA L E L ECT RO N I C S AS S O C I AT I O N
Each quarter, the Global Electronics Asso-
ciation releases
a list of standards that are new
or have been updated. To view a complete list of
newly-published standards and standards revisions,
translations, proposed standards for ballot, final
drafts for industry review, working drafts, and project
approvals, visit www.electronics.org/ipc-standards.
These are the latest releases for Q2 2026.
IPC-1401B, Environmental, Social
Governance (ESG) Management
System Standard
IPC-4101B specifies the requirements and best
practice guidelines for an effective environmental,
social, and governance (ESG) management system
to help an enterprise integrate ESG as a customer
requirement into products and value chain activi-
ties, as well as to identify and manage ESG risks and
opportunities through cooperation with customers
and suppliers, so as to enhance the competitive
advantages of the enterprise and its supply chain.
IPC-2223F, Sectional Design Standard
for Flexible/Rigid-Flexible Printed Boards
IPC-2223F establishes the specific requirements
for the design of flexible and rigid-flexible printed
board applications and their forms of component
mounting and interconnecting structures. The flex-
ible materials used in the structures are comprised
of insulating films, reinforced and/or non-rein-
forced, dielectric in combination with metallic mate-
rials. These interconnecting boards may contain
single, double, multilayer, or multiple conductive
layers and can be wholly flex, or a combination of
flex and rigid.
IPC-4202C, Specification for Flexible
Base Dielectrics for use in Flexible
Printed Boards
The IPC-4202C standard establishes the classifica-
tion system, qualification, and quality conformance
requirements for flexible metal-clad dielectric
materials to be used for the fabrication of flexible
printed boards. The purpose of IPC-4202C is to
classify and characterize base materials for use in
flex and rigid-flex boards for electronic applications.
It is to be used for procurement and quality assur-
ance activities.
IPC-6921, Requirements and Acceptance
for Organic IC Substrates
IPC-6921 establishes and defines the qualifica-
tion, performance requirements, and acceptance
requirements for organic IC substrates, including
wire bonding and flip-chip IC substrate products.
The purpose of IPC-6921 is to provide require-
ments for the qualification and performance of
rigid organic substrates based on the following
constructions and/or technologies. These require-
ments apply to the finished products unless other-
wise specified:
• Double-sided organic IC substrates with or
without plated through-holes (PTHs)
• Multilayer organic IC substrates with or
without PTHs or buried/blind vias/microvias
• Passive embedded circuitry on organic
IC substrates with capacitive planes or
resistive planes
IPC-9711, Generic Requirements for
Automated Inspection Process Control
IPC-9711 provides generic requirements for auto-
mated inspection systems to define, set up, estab-
IPC Standards
Released for Q2 2026
