90 I-CONNECT007 MAGAZINE I JULY 2026
lish, and apply process controls. Requirements
include inspection parameters, calibration, detect-
ability, resolution, threshold limits, and program
setups, measurement system analysis (MSA),
maintenance, and verification protocols. The stan-
dard establishes generic requirements applicable
to automated inspection systems and is intended
to be used in conjunction with product/process-
specific standards of the IPC-971X series.
IPC-9712, Requirements for
Automated Inspection Process
Control for IC Substrates
The IPC-9712 standard provides requirements for
automated inspection systems—automated optical
inspection (AOI), automated visual inspection (AVI),
and metrology—to define, set up, establish, and
apply process control for manufacturing integrated
chip substrates, including general and specific
process and equipment conditions. Requirements
include those for operating and inspection parame-
ters, vision systems, lighting conditions, calibration,
detectability, resolution, threshold limits, process
windows, program setups, measurement system
analysis (MSA), maintenance, and verification proto-
cols, in addition to the generic requirements of
IPC-9711.
IPC-9716A, Requirements for Automated
Inspection Process Control for Printed
Board Assembly Processes
IPC-9716A provides specific requirements for
automated inspection for printed board assembly
processes in addition to the generic requirements
of IPC-9711. Requirements are based on the use of
inspection systems such as solder paste inspection
(SPI), automatic optical inspection (AOI), and auto-
matic X-ray inspection (AXI).
The purpose of IPC-9716A is to set industry-
defined requirements for inspection systems to
reduce false calls, ensuring quality and reliability
while improving throughput and shortening cycle
times. This standard also supports electronics
manufacturers to enable advanced manufacturing,
real-time data analytics, and control capabilities.
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