I-Connect007 Magazine

I007-July2026

IPC International Community magazine an association member publication

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Qnity powering AI at scale. Enabling advanced interconnects for high-performance data centers. AI and hyperscale data centers are redefining PCB requirements—demanding higher speeds, greater density, and uncompromising reliability. Qnity enables diversified PCB designs, from flex and rigid-flex architectures to high-density interconnects. Kapton ® polyimide films and Pyralux ® flex laminates circuits from Qnity are engineered for superior signal integrity, thermal resilience, and design flexibility—enabling the performance and durability needed to scale AI and data center innovation. © 2026 Qnity Electronics, Inc. All rights reserved. Qnity™, the Qnity Node Logo and all trademarks and service marks designated with ™, SM or ® are owned by affiliates of Qnity Electronics, Inc. unless otherwise noted. Scan to learn more about Kapton ® Scan to learn more about Pyralux ®

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