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info-atotech@mks.com www.atotech.com Metallizing glass for the next generation of substrates Contact us to learn more about moving glass metallization toward production scale. A wet metalliza on process approach from MKS' Atotech for scalable adhesion, seeding, and TGV filling AI and HPC are pushing substrate technology beyond the limits of traditional organics. Glass is emerging as the next platform, enabling finer redistribution layers, tighter registration, and higher interconnect density. MKS' Atotech wet metallization process solution is built to solve the key challenges of plating on glass, such as adhesion, conformal seed layer deposition, and reliable TGV filling, helping turn that promise into scalable manufacturing. The process features VitroCoat ® GI, Cupratech ® GI M, and In-Pro ® Pulse TGV and supports high aspect ratios, copper-only seed removal, and panel-level productivity.