I-Connect007 Magazine

I007-Sept2026

IPC International Community magazine an association member publication

Issue link: https://iconnect007.uberflip.com/i/1546580

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48 I-CONNECT007 MAGAZINE I SEPTEMBER 2026 F abricators are confronting process re- quirements today that would have seemed foreign to the PCB shop not long ago, presenting both a promise and a sig- nificant manufacturing challenge. SCHMID is one company rising to it in big ways. Laurent Nicolet, VP for the Business Unit PCB, talks about the convergence between PCB fabrica- tion and semiconductor processing as feature sizes shrink, the emergence of glass as an at- tractive substrate and interposer material, and SCHMID'S embedded trace technology and the work toward moving that technology into high- volume manufacturing. SCHMID Pushes Toward the Submicron BY M A RCY L A RO N T, I - C O N N ECT 0 07 F E AT U R E I N T E RV I E W

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