IPC International Community magazine an association member publication
Issue link: https://iconnect007.uberflip.com/i/1546580
76 I-CONNECT007 MAGAZINE I SEPTEMBER 2026 The electronics industry ecosystem has never been more robust or dynamic. AI is a major factor in this rapid growth, fueling advances in high performance computing (HPC), advanced memory, high speed networking, and optical interconnects. In addition, advanced semiconductor packaging and data center build-out are pushing HDI and UHDI fabrication to circuit densities not seen previously. The Semiconductor Industry Association Roadmap is driving wafer transistor dimensions smaller, enabling faster rise times, and creating the need for finer-pitch interconnects. TSMC is advancing nodes toward 2 nm. Yet despite these remarkable semiconductor breakthroughs, "chips don't float." Silicon still requires a mounting platform, as well as printed circuits and organic IC substrates needed to create functional products. In North America, there is a growing need for greater HDI capability, yet the adoption of HDI board fabrication has been slow. Three obstacles (or chokepoints) may include: • Defining density needs • Process controls for fabricating reliable mi- crovias • Bare board/in-circuit test (ICT) solutions once HDI is assembled BY M I C H A E L CA R A N O, G LO BA L E L ECT RO N I C S AS S O C I AT I O N T RO U B L E I N YO U R TA N K HDI and UHDI Building the Foundation of Advanced Packaging BY M I C H A E L CA R A N O, G LO BA L E L ECT RO N I C S AS S O C I AT I O N