I-Connect007 Magazine

I007-Sept2026

IPC International Community magazine an association member publication

Issue link: https://iconnect007.uberflip.com/i/1546580

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Qnity powering AI at scale. Enabling advanced interconnects for high-performance data centers. © 2026 Qnity Electronics, Inc. All rights reserved. Qnity™, the Qnity Node Logo and all trademarks and service marks designated with ™, SM or ® are owned by affiliates of Qnity Electronics, Inc. unless otherwise noted. AI and hyperscale data centers are redefining PCB requirements—demanding higher speeds, greater density, and uncompromising reliability. Qnity enables diversified PCB designs, from flex and rigid-flex architectures to high-density interconnects. Kapton ® polyimide films and Pyralux ® flex laminates circuits from Qnity are engineered for superior signal integrity, thermal resilience, and design flexibility—enabling the performance and durability needed to scale AI and data center innovation. Scan to learn more about Kapton ® Scan to learn more about Pyralux ®

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