IPC International Community magazine an association member publication
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info-atotech@mks.com www.atotech.com To find out more about vPlate, scan the QR Code to the right. The increasing demand for finer lines and spaces within pattern plating technologies means that it is im- portant to greatly reduce the touching of the panel surface in order to avoid damages to the dry film. MKS' Atotech vPlate ICS equipment is specifically designed for the touchless transporta- tion of PCB panels for advanced manufacturing technologies such as SAP and (a)mSAP. It can be applied to various PCB types, ranging from standard multilayer and HDI to advanced HDI, rigid-flex, and IC substrates, with fine lines and spaces down to 8/8 μm. The vertical continuous copper plating equipment is fully automated and compatible with our InPro ® chemical process series for TH and BMV filling for advanced HDI, mSAP, and IC substrates, as well as our con- formal plating processes such as InPro ® VLF and InPro ® Flex 2. For HAR and HHD applications we provide a combination of our Cuprapulse ® IN process with vPlate ICS pulse plating capability. With vPlate ICS, we provide a one-stop-shop solution for effective equipment, software and process solutions. vPlate ® ICS – Vertical systems solution for IC substrates and advanced HDI