Introducing the no stress solution
for difficult to plate substrates
Via Dep 4550 Electroless Copper
1
STRESS FREE
COPPER DEPOSIT
Via Dep 4550 has significantly less
internal stress than conventional
electroless copper products.
LESS STRESS ON
THE ENVIRONMENT
Difficult surfaces can be processed
without the use of harsh chemicals
such as hydrazine.
WON'T STRESS OUT
YOUR BUDGET
Via Dep 4550 has lower operating
temps (90-100°F) and is compatible
with conventional equipment.
Polyimide (PI), FPC, rigid-flex windows and resin-filled vias are
pushing the limits of current electroless copper processing.
See how Via Dep 4550 meets the challenge
5630 Pioneer Creek Drive
Maple Plain, MN 55359
P: 800-321-9050 • F: 763-479-3344
400 Corporate Court, Suite A
South Plainfield, NJ 07080
P: 800-536-1959 • F: 908-222-3344
