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60 SMT Magazine • February 2014 FEATUrE volumes being deposited. This phenomena was noted with other low area-ratio apertures. The standard deviation charts in Figure 8 help provide a process capability view across all area ratios and process conditions tested. In these charts, standard deviation is quoted bIG IDeaS ON MINIaTurISaTION continues Figure 6: Solder paste volume deposited for spe- cific area ratios. Comparing circular (ø) and square (□) apertures; with/without ProActiv (PA) and with type 4 (T4) and type 4.5 (T4.5) solder paste. Figure 7: Solder paste volume scatter plots for apertures with area ratios of 0.34, 0.40 and 0.46. Comparing circular (blue) and square (red) aper- tures; with/without ProActiv (PA) and with type 4 (T4) and type 4.5 (T4.5) solder paste.