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40 The PCB Magazine • April 2014 I have advanced from creating PCB designs into the EDA tool world, but I have created software programs and other inventions based on those first years with my electronics industry mentors. When asked what I miss most about designing, more times than not, I say "I miss the three- phone-call method, because it always worked on every prototype design I was given.'" I still believe in the process Tom and I co- developed. In this day and age where design in - formation is just thrown over the wall from the design house to the fabrication house, I would be curious to hear if there are still human-to- human interactions, and if there are similar, and hopefully, better ideas on how both the design and fabrication community can, should, or do interact in reducing the overall time required in the concept-to-manufacturing electronics design process. Please feel free to contact me via e-mail. In summary, thank you again to every fabrica- tion process engineer who has contributed your time and knowledge to those of us who seek your expertise. Personally, I have been truly blessed and have grown by your collective wisdom. PCB FROM SINGLE-SIDED TO HDI continues New Dimension in Pinless Multilayer Registration by Real Time with...productronica 2013 at productronica 2013, i-con- nect007 technical editor pete starkey caught up with Victor lázaro gallego, r&d manager at chemplate materials, s.l., to discuss the new pinless reg- istration process from chemplate. in Victor's words: "the new development is called in- duBond plr (pinless registration). this machine simply measures every layer (front-to-back image registration and layer shape) and uses that information to align or register automatically, layer- to-layer during the multilayer building up process of the stackup. this ma- chine guarantees the best fit possible of the layer-to-layer registration while compensating for any dimensional distortion caused by scaling, shrinkage or image registration. once the layers are registered, the machine holds that relative position by using induction bonding technology. the machine has been developed in a modular way that allows it to be fully automated depending on the options." realtimewith.com CliCk To View FEaTuRE vIdEo InTERvIEw daniel J. smith is a principal technologist for raytheon missile systems. He has taught multiple aspects of the pcB design pro- cess internationally, and he has authored several pcB-related pat- ents, articles, and standards over the past 30+ years. to contact smith, click here.

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