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24 SMT Magazine • May 2014 easy for operators to indentify real defective HIP defects based on these images from the re- pair station. Therefore we should be very care- fully to set threshold correctly to detect HIP. We prefer to detect some HIP without the high rate of false calls on one BGA especially for large-volume production based on current AXI capabilities. D. aXI 4 (Tomosynthesis) AXI 4 uses tomosynthesis technology also. Its resolution can be adjusted per different pack- age or solder joints. We had test data from three sites with little fine-tuning for the program. The AXI 4 main algorithm thresholds for detecting HIP are listed in Table 7. Similarly, different al- gorithm thresholds for two boards are adjusted HEaD-IN-PILLoW X-Ray INSPECTIoN continues feATuRe Figure 5: axi 3 "open outlier" measurement data for pad slices from site 2 (board #495 & #266). Table 6: Test summary with AXI 3. Figure 6: axi 3 images of detected hip; escaped hip, and false call pin (board #495).