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May 2014 • SMT Magazine 29 HEaD-IN-PILLoW X-Ray INSPECTIoN continues ceedings, August 2008. 2. Jennie S. Hwang, "Can Microstructure In- dicate a Good Solder Joint? Part III," SMT Maga- zine, October 2012. 3. Flextronics ATG, "CT versus AXI with HIP," project is ongoing, October 2012. acknowledgements The sites of Guadalajara, Mexico; Austin & Milpitas, U.S.; Malu & Zhuhai, China; Ti- misoara, Romania Engineering and produc- tion teams of Flextronics Inc.; AXI 3, AXI 4 and 2DX vendors support teams; and Peter Chip- man, and Dr. Evstatin Krastev for their timely support. SmT feATuRe Summary • Current AXI has capabilities to detect some HIP with right Algorithm threshold set- tings. The tomosynthesis technology looks bet- ter than laminography technology for detecting HIP as the tomosynthesis technology are utiliz- ing digital technology as compared to the ana- log laminography technology. • The algorithm threshold settings are very critical for detecting HIP. The false call number has to be reasonable for the production line. The AXI program optimization is based on its measurement data analysis. • There are no clear image differences be- tween good solder joint and HIP with current AXI machine, especially for HIP type defect AA15 shown as in Figure 11. Therefore we have to have good balance between HIP defect es- caped and false call. • We are looking forward to see AXI ma- chine with more accurate and repeatable mea- surement data, and better image separation be- tween good solder joint and HIP pins. • 2DX and large board CT are very impor- tant techniques used to verify the AXI results and fine-tune the algorithms. References 1. Zhen (Jane) Feng, Juan Carlos Gonzalez, Evstatin Krastev, Sea Tang, and Murad Kurwa, "Non-Destructive Techniques for Identifying Crack Defect in BGA Joints: TDR, 2DX, and Cross-section/SEM Comparison", SMTA Pro- Figure 11: CT images for hip (ab15, Z15 and aa15), aC15 is good. Alejandro Castellanos works in test area man- agement at flextronics guadalajara. He has been working with the Advanced engineering group in order to improve AXI detection and share best practices. Dr. Zhen (Jane) Feng is a process engineering manager of the flextronics Advanced engineer - ing group. She works in worldwide assembly and Test Technology Division. David geiger is director of the Advanced engi- neering group at flextronics. Murad Kurwa is vice president of the Advanced engineering group at flextronics.