Issue link: https://iconnect007.uberflip.com/i/304995
80 SMT Magazine • May 2014 tifies defects upstream in the process where the feedback loops are real time and repair costs are the lowest. We use a comprehensive approach that considers all test sectors, from automated optical inspection (AOI) to functional test, and put together a plan that is product-specific and removes the redundancy of testing the same characteristic multiple times. In this way, we maximize the effectiveness of the test suite while minimizing the cost of quality across the supply chain. That is why in our experience, early sup- plier involvement during the product design phase in a design for test (DFT) engagement is so important. In working together as early as possible, we can ensure that the design offers the right opportunities for test coverage and that we apply that coverage in the real world to maximize first pass yields in our assembly pro- cesses, verify sub-component operation, and deliver the lowest possible field failure rates for the customer. Are the technologies you are using now ca- pable of addressing most of the inspection and testing challenges you refer to? Yes, in most cases, as technology has con- tinued to advance in all areas, and in a number of cases, it provides overlapping test coverage across equipment sets with complementary technologies. This provides options for reduced levels of inspection/test and more flexible/cus- tomized test strategies. AOI systems now have higher resolution cameras to cover smaller components, are bet- ter at detecting poor solder joints, and can now cover co-planarity issues by using angular views. X-ray technology has standardized on oblique angles for detection of non-wetting opens/ head-in-pillow defects and with the addition of digital tomosynthesis, we have a greater ability to inspect 3D packages like package-on-package (PoP) with better resolution/field of view than ever before. Flying probe equipment can handle finer pitches with higher accuracy, have added top and bottom probes for better throughput, and have added features like power on tests. Manu- facturing defect analyzers (MDA) have added higher probe counts and additional test fea- tures, while ICT has seen advances in mechani- cal fixturing so that we add probes down to .018" apart, to access denser products with finer pitch components. Advances in functional test software and hardware have allowed us to capture more para- metric information than ever, especially in ap- plication areas such as RF and optical. Is there need for an even better test/inspec- tion solution? If so, what should it be like, con- sidering the increasing complexity in electron- ics assembly and the continuing miniaturiza- tion trend of components? At SMTC, we are continuously evaluating new platforms and test techniques to ensure we are one step ahead of the next challenge. This is driven from technology roadmap ses- sions we hold with our customers on an annual basis. From our perspective, we would like to see more cost-effective detection techniques at the primary attach operation to make it more of a closed-loop operation with immediate feed- back. Integrated and cost-effective AOI solu- tions at chip placement are a prime example. As technology continues to trend to smaller packages and stacked packages, where access is limited, test methods such as JTAG become almost mandatory. More robust boundary scan libraries that include the testing of core logic in THE FUTURE oF TEST continues feATuRe