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58 SMT Magazine • July 2014 References 1. J.A. Brusse, G.J. Ewell, J.P. Siplon, "Tin Whis- kers: Attributes and Mitigation", 22nd Capacitor and Resistor Technology Symposium Proceedings, March 25-29, 2002, pp 67-80. 2. A. Selucker, M. Johnson, "Microstructural Characterization of Electrodeposited Tin Layer in Re- lation to Whisker Growth", Capacitor and Resistor Technology Symposium Proceedings, October 1990, pp 19-22. 3. K.M. Cunningham, M.P. Donahue, "Tin Whis- kers: Mechanism of Growth and Prevention", 4th In- ternational SAMPE Electronics Conference Proceed- ings, June 12-14, 1990, pp 569-575. 4. B.Z. Lee, D.N. Lee, "Spontaneous Growth Mechanism of Tin Whiskers", Acta Metallurgica, Vol. 46, No. 10, 1998, pp 917-922. 5. J. Smetana, "Theory of Tin Whisker Growth: The End Game", IEEE Transactions on Electronics Packaging Manufacturing, January, 2007, pp 11-22. 6. S. Mathew, M. Osterman, T. Shibutani, Q. Yu, M. Pecht, "Tin Whiskers: How to Mitigate and Man - age the Risks", International Symposium on High Density Packaging and Microsystem Integration, June 26-28, 2007, pp 1-8. 7. S. Barr, "Mitigating and Preventing the Growth of Tin and Other Metal Whiskers on Critical Hard- ware", Proceedings of the 2nd IAASS Conference, May 14-16, 2007. 8. J.S. Kadesch, H. Leidecker, "Effects of Uralane Conformal Coating on Tin Whisker Growth", Pro- ceedings of the 37th IMAPS Nordic Annual Confer- ence, September 10-13, 2000, pp 108-116. 9. J.S. Kadesch, J.A. Brusse, "The Continuing Dan- gers of Tin Whiskers and Attempts to Control Them With Conformal Coat", NASA's EEE Links Newsletter, July 2001. 10. J.A. Brusse, H. Leidecker, L. Panashchenko, " Metal Whiskers: Failure Modes and Mitigation Strate- gies", IEEE Microelectronics Reliability and Qualifica- tion Workshop, December 5-7, 2007. 11. T. Woodrow, E. Ledbury, "Evaluation of Con- formal Coatings as a Tin Whisker Mitigation Strate- gy", IPC/JEDEC 8th International Conference on Pb- Free Electronic Components and Assemblies, April 18-20, 2005. 12. T. Woodrow, E. Ledbury, "Evaluation of Con- formal Coatings as a Tin Whisker Mitigation Strategy, Part 2", Proceedings of SMTA International Confer- ence, September 24-28, 2006. 13. S. Han, C. Jang, B. Han, M. Osterman, "Ex- amination of Properties and Failure Mitigation Of- fered by Conformal Coats", Center for Advanced Life Cycle Engineering Electronic Products and Systems Consortium Technical Review, October 13-14, 2009. 14. T. Nakagawa, T. Yamada, N. Nemoto, K. Sug- anuma, "Evaluation of Conformal Coating for Miti- gation of Tin Whisker Growth (Part II)", 4th Inter- national Symposium on Tin Whiskers, June 23-24, 2007. 15. S. Han, M. Osterman, S. Meschter, M. Pecht, "Evaluation of Effectiveness of Conformal Coatings as Tin Whisker Mitigation", Journal of Electronic Ma- terials, Vol. 41, Iss. 9, 2012, pp 2508-2518. 16. C. Hunt, M. Wickham, "Measuring the Miti- gation Capability of Conformal Coatings: Part 2", 4th International Symposium on Tin Whiskers, June 23-24, 2007. 17. C. Coombs, ed. Printed Circuits Handbook 6th Edition. New York: McGraw-Hill, 2008. 18. D. Hillman, T. Pearson, T. Lesniewski, "An In- vestigation of Whisker Growth on Tin Coated Wire and Braid", Proceedings of the 2012 IPC APEX Expo, 2012. 19. http://nepp.nasa.gov/whisker/ 20. W. Fox, L. Woody, "Conformal Coatings for Tin Whisker Risk Management", Proceedings of the 2010 IPC APEX Expo, 2010. Linda Woody is a member of the Lockheed Martin Production Technical Excellence staff as a Corporate SME for electronics as- sembly and soldering processes. She has been in the electronics industry for 36 years and she received a patent for her work in laser soldering in 2001. William fox is the lead materials engineer for the Lockheed Martin ocala Advanced Services Labora- tory focusing on failure analysis and process and materials devel- opment. He has authored or co- authored nine technical papers including pa- pers on mixed-metal alloy soldering processes and properties and tin whisker mitigation and analysis. fEATURE TIN WHISKER RISK MANAGEMENT By CoNFoRMAl CoATING continues