SMT007 Magazine

82 SMT Magazine • July 2014 ARTiCLE MEETING FuTuRE STENCIl PRINTING CHAllENGES continues figure 8: Circles vs. squares. figure 9: Solder mask defined vs. non-solder mask defined (copper defined) pads.

• Cover
• Featured Content — Tin Whiskers
• Contents
• Guest Column — Electronic Assembly with Solder: an Unblinking Look at "The Devil We Know"
• Video Interview — Major Changes in the Last Eight Decades
• Feature — Tin Whiskers: Capsulization
• Feature — Whisker Growth in Tin Alloys on Glass-Epoxy Laminate
• Feature — Tin Whisker Risk Management by Conformal Coating
• News — Mil/Aero007 News Highlights
• Column — DFARS Flow Downs and Trusted Suppliers
• Video Interview — A Glimpse of the Future
• News — SMTonline Market News Highlights
• Column — More Stencil Questions (and the Answers!)
• Video Interview — DEK Deals with Automotive Device Miniaturization
• News — SMTonline Supplier/New Product News Highlights
• Article — Meeting Future Stencil Printing Challenges with Ultrafine Powder Solder Pastes
• Short — Efficient Thermal Cooling and Heating
• News — Top Ten News Highlights from SMTonline this Month
• Events Calendar
• Advertiser Index and Masthead