Design007 Magazine

October 2014 • The PCB Design Magazine 1 October 2014 Signal Integrity, Part 1 of 3 by Barry Olney p.24 ALSO: Thermal Characterization of LEDs: Enabling the Upcoming Lighting Revolution by Dr. John Parry p.34

• Cover
• Featured Content — Signal Integrity
• Contents
• Column — So You Want to Write an Article!
• Feature — Sink or Swim at 28 Gbps
• Feature Column — Signal Integrity, Part 1 of 3
• Video Interview — Embedded Components Standard Update
• News — PCB007 News Highlights
• Article — Thermal Characterization of LEDs: Enabling the Upcoming Lighting Revolution
• Column — This is Sketch Routing, Part 2: Quality
• Column — Chilling Out with Conductive Adhesives
• Video Interview — IBM Seeking the Next Generation of Technologists
• Short — New Mechanism of Photoconduction for Next-gen Devices
• News — Mil/Aero007 News Highlights
• Column — Tarzwell's First—and Last—Lean Meeting
• Column — Blink and You Will Miss It
• News — Top Ten News Highlights from PCBDesign007 this Month
• Events Calendar
• Advertiser Index and Masthead