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14 The PCB Magazine • November 2014 tion, photolithography and chemical wet-etch- ing technologies. For the noble metals (Au and Pt), gas phase deposition methods were applied. The material is heated within a high vacuum chamber up to its boiling point. Clusters of atoms evaporate and deposit on the substrate forming a noble metal layer structure. If neces- PCB has lines and spaces down to 25 µm for signal paths in compare to an ASIC within a 40 nm range. However, the fabrication size in the semiconductor industry is restricted to 12", while the PCB world manufactures in 12 x 18" large panel sizes. The substrates were structured using standard PCB surface cleaning, activa- NOBLE METAL PCB MANuFACTuRING FOR DIRECT IMPLANTS continues figure 1: decrease of the lines, spaces, and pad sizes within the last few years. figure 2: a hybrid PCb combining standard PCb with noble thin film material technology.