48 The PCB Magazine • November 2014
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Technica uSA Installs Second Maskless
DI Machine at APCT
frank medina, president of technica usa, an-
nounced recently that sales and activity for mask-
less di equipment continues to be successful: "we
are very pleased with the continued sales activity
and interest in the maskless di equipment. we
have installed four units in the past quarter and
have had several successful evaluations during this
same period."
ventec Invests in FOD-avoidance
Program
the avoidance of foreign object contamination
continues to be a fundamental objective in ven-
tec europe's uK prepreg fabrication facility, and
the company is proud to announce that its epoxy
prepreg cutting and slitting department has been
brought to the same standard of clean-room op-
eration as already established for its polyimide pre-
preg.
Isola Group Withdraws IPO Plan
isola Group ltd., a maker of laminate materials,
filed with u.s. regulators on tuesday to withdraw
its up to $100 million initial public offering of com-
mon shares.
Insulectro Signs Distribution
Agreement with DuPont
insulectro and duPont microcircuit materials
(duPont) recently signed an agreement that
allows insulectro to distribute key duPont
polymer thick film paste products to u.s. custom-
ers in the thin film photovoltaic, printed circuit
board, smart card, and membrane touch switch
markets.
ESI unveils New Laser
Micromachining Platform
electro scientific industries, inc. has announced
the µflex series multi-axis precision laser micro-
machining platform, enabling new levels of price-
performance in laser applications for consumer
electronics, medical devices, automotive compo-
nents, and many other industries.
Mitsui Kinzoku Expanding Capacity
of FaradFlex in Asia
faradflex is used as a material for improving pow-
er delivery, reducing resonances and noise, major
challenges that information and communication
equipment must overcome. this enables higher
processing speeds and higher capacity, in multi-
layer PCbs for high-speed transmission routers,
servers, and supercomputers.
Enthone Nets ISO/IEC 17025
Accreditation
enthone ltd. (woking, uK) has received accredi-
tation to the iso/ieC 17025:2005 standard. the
united Kingdom accreditation service (uKas)
conducted the independent, third party certifica-
tion and issued tl# 8202.
Rogers Debuts Laminates with
Rolled Copper Foils
rogers Corporation's advanced Circuit materials
division, a global leader in microwave PCb materi-
als, recently introduced rolled copper cladding op-
tions with its ro3003, ro3035, and ro3203 low
dielectric constant laminate materials.
Atotech Launches CupraEtch SR
Cupraetch sr is one of the company's surface
pretreatment products, specifically developed to
maximize the adhesion of dry and liquid solder-
masks and photoresists.
Fuji America, FlexLink Sign
Partnership Agreement
fuji america Corporation and flexlink systems,
inc. recently signed a north american agreement
to bring board handling equipment and conveyor
systems by flexlink to fuji's existing product offer,
providing turnkey solutions to the PCb industry.
PCB007 Supplier/New Product
News Highlights
48 The PCB Magazine • November 2014
