Atotech Headquarters
P.O. Box 21 07 80 · 10507 Berlin · Germany · www.atotech.com
Tel. +49 30-349 85-0 · Fax +49 30-349 85-777
Soldering Au-Wire Al-Wire
On the same surface
SolderBond Gold Wire Pull Test
after Thermocycling
15
10
5
0
Pull
Force
/
average
[cN]
0 24 250 500 1000 2000
- 40°/125°
15% average
std dev
Thermo cycling
Electroless Ni
Aurotech CNN mod.
Cleaner
Pro Select SF
Dip
Aurodip (Option)
Micro Etch
Micro Etch SF
Predip
Pre Dip
Immersion Au
Aurotech DC 10
Activator
Aurotech Activator 1000
Fine Line Post Dip
Aurotech FL Plus Post
Dip (Option)
Electroless Pd
PD-Tech
Process Flow
Features and Benefits
▪ Pure Pd-layer without phosphorous
▪ Softer than phosphorous containing
Pd-layers
▪ Green benefit: EDTA-free process
▪ Au-wire bondable
▪ Excellent solder joint reliability
▪ Good thermo cycling performance
NiPdAu (ENEPIG)
Deposit Structure
Electroless Nickel 4.0 µm - 6.0 µm
Electroless
Palladium
0.05 µm - 0.3 µm
Immersion Au 0.02 µm - 0.06 µm
Functionality
Soldering
Eutectic Sn/Pb Good
Sn-Ag-Cu Alloy Excellent
Contact Switching Yes
Au Wire Bonding Yes
Final Finishing
Universal Finish Solderbond (ENEPIG) –
NiPdAu for Soldering and Au-Wire Bond
Electronics
Pure
Pd
Qualified
for
Aerospace
&
Satellite
Technology
Gold
Wire
Bond
Finish
