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18 SMT Magazine • April 2015 results and Discussion Figures 10 through 26 show the SIR results obtained from each scenario mentioned in the experimental section. A discussion of the SIR results can be found beginning after Figure 26. The intent of this paper is to show the over- all effect, if any, that reflow profiling has on the SIR performance of no-clean solder pastes. Figures 10 through 26 plot every SIR reading of every SIR pattern. Viewing the data in such a way makes it difficult to identify an overall trend from scenario to scenario. In order to be able to do this more easily, an average SIR value was calculated for each scenario. For each scenario, two boards were prepared, with four SIR patterns per board. SIR readings were taken for each SIR pattern every 20 minutes over the course of 168 hours (1 week). The result is the accumulation of 4032 SIR readings from which the average SIR value was obtained. ElECTriCal rEliaBiliTy OF NO-ClEaN SOlDEr paSTE Flux rESiDuES continues FeAture figure 10: Halogen-free solder paste, 225°c peak temperature ramp profile (run 1). figure 12: Halogen-containing solder paste, 225°c peak temperature ramp profile (run 1). figure 11: Halogen-free solder paste, 225°c peak temperature soak profile (run 1). figure 13: Halogen-containing solder paste, 225°c peak temperature soak profile (run 1).