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22 SMT Magazine • May 2015 can be considered and the selection should be based on data and not assumptions. It is important to consider the interaction be- tween multiple technologies in all areas during development and deployment since several ad- vanced technologies will, in most cases, be used on the same product. Based on our studies, 125 µm component-to-component is feasible with both a 75 µm and 100 µm stencil thickness. At 100 µm component-to-component spacing a 4 mil (100 µm) stencil is not acceptable, but despite a DMPO of around 370 with a 3 mil (75 µm) stencil, this can in some cases be acceptable. acknowledgements The authors would like to thank Multek and our existing component and machine suppli- ers in regard to valuable inputs on assembly, printed circuit board design/fabrication and high quality samples for our builds. The authors would also like to thank our failure analytical laboratories in Zhuhai, China and Penang, Ma- laysia for their support. SmT References 1. Geiger D.A., Sjoberg J., Lee. J., and Aran- da. R., "0.3 mm pitch CSP process development and PCB design," Proceedings of SMTAI 2011, Fort Worth, TX. 2. Geiger D.A., Sjoberg J., Aranda. R., Kurwa M., "Assembly and design challenges for new generation 0.3 mm pitch CSP and 0.4 mm pitch TMV PoP," Proceedings of SMTAI 2012, Fort Worth, TX and SMTA South East Asia, Penang. 3. Jonas Sjoberg, Ranilo Aranda, Henley Zhou, Jumbo Huang, Jimmy Chen, Sky Xiang, Isaias Daguio, William Uy, JieWei Lu, George Liu, GuoChao Liu, David Geiger, Murad Kurwa, "Development and Deployment of High Densi- ty Assembly," Proceedings of SMTA 2013 China, Shenzhen. mINIaTURIzaTION WITH THE HELP OF REDUCED COmPONENT-TO-COmPONENT SPaCING continues Feature figure 13: cross-section of a 01005 component reflowed in nitrogen. Jonas Sjoberg is a technical consultant with indium (formerly with Flextronics AEg, Malaysia). ranilo aranda is process engineering manager with flextronics aeg, Zhuhai, china. David geiger is director at flextronics aeg, California, uSA. anwar Mohammed is senior director at Flextronics AEg, California, uSA. Murad Kurwa is senior vp at flextronics aeg, California, uSA.