PCB007 Magazine

12 The PCB Magazine • August 2015 by David Dibble neW agreemenTS inc. We have completed our I-Connect007 Sur- vey: The War on Failure. We surveyed compa- nies in the following businesses asking ques- tions about their greatest areas of concern in key areas around quality and process control: • Design • PCB fabrication • Assembly • EMS • OEMs • Consultants • Suppliers The War on Failure We were somewhat surprised that across the various businesses the major issues boiled down to four: 1. Poor process control (46%) 2. Poor training of employees around quality (40%) 3. Inability to quickly identify where and how waste is being created (37%) 4. Poor technical support from suppliers (31%) As might be expected, these companies most wanted answers to the following ques- tions (Table 1). In this article, we will attempt to provide answers to these questions. Please note that po- FeAture Table 1.

• Front Cover
• Featured Content — The War on Process Failure
• Contents
• Feature Column — The War on Process Failure
• Feature — The War on Failure
• Feature — Fighting the War on Failure with Supplier Analytics: An Interview with Fane Friberg
• EIN Market Highlights
• Feature — Latent Short Circuit Failure in High-Rel PCBs due to Cleanliness of PCB Processes and Base Materials
• Feature Summary — Declaring War on Failure in Electronics
• MilAero007 Highlights
• Feature — Plating and Quality are Close Partners
• PCB007 Supplier/New Product Highlights
• Column — Designing Flex Circuits for Domestic Prototyping
• Top Ten Recent Highlights from PCB007
• Events Calendar
• Advertiser Index & Masthead
• Back Cover