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58 The PCB Magazine • November 2015 surface with both sides of the inlay surface is only possible in a part of the manufactured lot. This can lead to varying thicknesses of the ther- mal interface material used during heat sink in- stallation. The inlay technology from Schweizer is dif- ferent as the inlays are not pressed into a fin- ished circuit board but are laminated into the assembly group as part of a multi-layer manu- facturing process. In this process, the prepregs used equalize the occurring differences in thick- ness between inlay and circuit board. The inlay can be entirely embedded in the matrix, leading to an electrically insulated inlay or it can be installed flush with one side of the entire structure of the circuit board, enabling it to be used for optimal thermal transition. As the inlay is usually significantly wider than the component assembled on it, an im- mediate heat dissipation takes place within the inlay. This enlarged transition area at the heat sink leads to lower thermal resistances in the area of the thermal interface material. Apart from thermal management, such in- lay circuits can also be used for conducting high currents at low ohmic losses. Most applications utilize the low ohmic loss- es as well as the optimized thermal interconnec- tion to the heat sink, which is why the inlay board represents a high-end solution based on conventional printed circuit boards. The Smart p² Pack The precondition for miniaturization of high power electronics is a significant reduc- tion of losses within the circuit and the efficient removal of power dissipation from the confined space. The p² Pack technology enables super-flat power modules with a thickness of 1–1.4 mm with reduced power dissipation and improved switching behavior as a result of using embed- ArTiCle ConDUCTInG Very HIGH CUrrenTS THroUGH PCB SUBSTrATeS AT HIGH AMBIenT TeMPerATUreS Figure 7: Inlay board with copper inlays of 2 mm thickness. Figure 8: lead frame with cavities for assembling power semiconductors. Figure 9: lead frame with assembled moFSets.