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36 The PCB Design Magazine • August 2016 Then fast forward to the recent publica- tion of the Printed Circuits Handbook! Just take a look and see the vast quality of information presented in this latest volume. You can't help but recognize that the reader would be getting a priceless education from the authors of the various chapters in the book. And just take a look and note where all these authors and edi - tors reside. Yes, the North American electronics and printed circuit board industry is in good hands. _____________________________________ George Milad National Accounts Manager for Technology, Uyemura USA (Chapters 33, 35) I think that OEMs should discontinue spe- cific process qualifica- tion and concentrate on specifying the attributes that they desire in the finished product. The OEM may run a battery of tests on a specific vendor product and it may pass and then they specify the qualified vendor. Among the drawbacks of this method is that, defective parts may still occur as a result from variations in the processing conditions, that the manu- facturer or the OEM, may not be aware of. In addition, new processes with a wider operating window may be available that the manufacturer may want to try but feels trapped in the quali- fied process. Another advantage of specifying the at- tributes that they desire in the finished prod- uct is that the responsibility for the deliv- ered parts remains with the manufacturer. In this case the manufacturer chooses the process that fits his shop conditions and may choose a vendor that he feels is knowl- edgeable and offers him the best service and problem resolution as the need arises. Some of the qualification procedures may be so extensive and cumbersome that they impede the progress of the industry as it comes up with better more robust processes that have not un- dergone qualification. Jason Keeping Corporate Engineering Analyst, Celestica, Inc. (Chapter 44) Q: How was the expe- rience of putting together your chapter of the Hand- book? A: As a technology leader for our organiza- tion, I have written documents for industry in the past; however, this was my first opportunity to have information put into hard copy book not as a document but as a book, and it was a great pleasure. As the content of this chapter had not changed much in the past decade based on the legacy of information that was already available, my real goal was to find content that was new that could enhance this section for readers. With recent work that I had com- pleted for the IPC-HDBK-830 Conformal Coat- ing Handbook, I had this fairly easily available and just needed to confirm all aspects and have them incorporated into this handbook. After this was done the overall flow and images just needed to be amended and put more into the current century. With current industry progress on nano materials and new developments, the next time this section may have new material types as well as content to empower its readers both in hardcopy and digital form. With the speed that our industry is devel- oping at the moment, the amount of changes that were encountered within this edition will most likely be exponential and not linear, just to maintain a parallel path to these market in- novations and changes. Q: Do you see any challenges in PCBs in gen- eral or PCB education in particular? A: Within my role I work with all market segments between military/aerospace, industri- al, telecommunication and even consumer cov- ering all aspects of ruggedization from assembly cleaning, staking, edge/corner/complete under- fill, and selective/atomized/vapour/dip depos- ited conformal coating and even component encapsulation and full assembly potting tech- THE AUTHORS OF THE PRINTED CIRCUITS HANDBOOK SPEAK