SMT007 Magazine

Independent Test Services for the Electronics Supply Chain Qualification & Conformance Testing Reliability Assessment Material Characterizations Failure Analysis CAF, ECM, SIR Thermal Shock/Cycling SEM/EDS, XRF, FTIR IC - Anion, Cation and WOA TMA, DSC, TGA, Thermal Conductivity www.thetestlab.cn techsupport@thetestlab.cn

• Cover
• Featured Content — Military and Aerospace
• More Content
• Column — Failure is Not an Option
• Short — I-Connect007 Survey: A Look at the Mil/Aero Industry—ITAR
• Column — The Theory Behind Tin Whisker Phenomena, Part 4
• Feature — The Blackfox Advanced Manufacturing Program for Military Veterans
• Feature Interview — Asteelflash on Mil/Aero Challenges, ITAR Compliance, and Opportunities
• Column — Recycling Substrates and Components in Mil/Aero Assemblies: Secure Metals Recovery
• Supply Lines Highlights
• Feature — Mitigation of Pure Tin Risk by Tin-Lead SMT Reflow—Results of an Industry Round-Robin
• Short — South Carolina's Aerospace Industry Trends Towards Sustainable Growth
• Column — Smart for Smart's Sake, Part 1
• Short — I-Connect007 Survey: A Look at the Mil/Aero Industry—Lead-Free
• MilAero007 Highlights
• Feature — IPC Certification Program's Space Hardware Addendums Training and Certification
• Column — The Child is Father of the Man: Turning the Relationship Between the Electronic Product Assembly Employer and Recent Graduates Upside Down
• EIN Market Highlights
• Feature — IPC-1782 Standard for Traceability Supporting Counterfeit Component Detection
• Column — How to Specify a Custom Machine
• Feature — Defect Features Detected by Acoustic Emission for Flip-Chip CGA/FCBGA/PBGA/FPBGA Packages and Assemblies
• Short — System Might Detect Doctored Images and Videos for the Military
• Feature Interview — Ionics Talks Industry 4.0, Mil/Aero Opportunites, and Supply Chain
• Top Ten Recent Highlights from SMT007
• Events Calendar
• Advertiser Index and Masthead
• Back Cover