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52 SMT Magazine • January 2017 Living Up to Their Name at Alpha Assembly Solutions At SMTAI in October, I-Connect007's Judy War- ner spent some quality time with Alpha Assembly Solutions' Jason Fullerton, to discuss Alpha's in- novative new products. Fullerton also discussed a paper he was presenting, which compares two lead-free, silver-free alloys in a selective soldering application. Digi ConnectCore 6UL Creates a Big Buzz at electronica Guy Volckaerts, director for EMEA embedded sales at Digi, speaks with I-Connect007's Judy Warner about Digi's star-of-the-show at the recent elec- tronica event in Germany—the Digi ConnectCore 6UL—a quick, simple, feature-rich, yet very flexi- ble system-on-module solution for OEMS and de- velopers. KIC Shows Solutions to Voiding Problems via Optimized Reflow Profiling At the recent SMTAI event, MB (Marybeth) Allen of KIC speaks with I-Connect007's Patty Goldman about her company, and discusses some of the de- tails of her presentation titled "Optimized Reflow Profiling to Minimize Voiding". Electrolube Contact Lubricants Extend Switch Lifetime Electrolube's Contact lubricants have been proven to extend the lifetime of switches by more than 300%, increasing performance in a variety of ap- plications and preventing the need for expensive maintenance. Molex Solder on Polyester Substrate Delivers Flexible, Cost-effective Circuitry Molex has introduced Solder on Polyester Sub- strate, a flexible, economical alternative to rigid PCB and polyimide. Surface mount (SMT) com- ponents, including fine-pitched integrated circuits (ICs) are attached with low-temperature solder and encapsulated on a polyester substrate. Alpha's Mitch Holtzer to Present on Minimizing Voiding in Bottom Terminated Components at IPC APEX 2017 Mitch Holtzer, Director of Reclaim for Alpha As- sembly Solutions, a part of the MacDermid Per- formance Solutions group of businesses, will pres- ent the paper titled "Minimizing Voiding in Bot- tom Terminated Components Using Vacuum As- sisted Reflow", at IPC APEX EXPO 2017. SED Systems Chooses ACE Selective Soldering Equipment Once Again ACE Production Technologies, Inc., a leading sup- plier of selective soldering systems, is pleased to announce that Calian's system engineering divi- sion, SED Systems has purchased a KISS-102 selec- tive soldering machine from ACE. Super Dry Launches Series of Expandable Desiccant Cabinets Moisture specialist Super Dry has launched a new series of desiccant storage solutions. Comple- menting the company's extensive range of ultra- low humidity drying and storage cabinets, the MSD Series features very high performance dehu- midification in a modular design that costs 50% less than conventional solutions. Indium's Karch Wins Best Presentation at IMAPS Autumn Conference 2016 Indium Corporation's Andreas Karch, Regional Tech- nical Manager for Germany, Austria and Switzerland, was recognized for his technical presentation on new solder material technology in the manufacturing pro- cess of IGBT modules, at the recent IMAPS Autumn Conference in Munich, Germany. Karch's presentation featured a new method that produces strong, reliable solder joints that resist cracking and thermal fatigue. Goepel Adds Solder Bead Detection Function in AXI System The automatic X-ray system X Line·3D from GOE- PEL electronic now has a new test function for au- tomated detection of solder beads. Supply Lines Highlights

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