SMT007 Magazine

April 2017 • SMT Magazine 1 APRIL 2017 The Complex World of Soldering p.12 Predicting Solder Paste Transfer Efficiency and Print Volume p.22 Voiding Control at High-Power Die-Attach Preform Soldering p.32 Much More! ENGINEERING SOLUTIONS FOR PCB MANUFACTURING M A G A Z I N E

• Cover
• Featured Content — Soldering Excellence
• More Content
• Column — What a Tangled (Soldering) Web We Weave!
• Short — New I-007eBook—Solderless Assembly for Electronics: The SAFE Approach
• Feature Interview — The Complex World of Soldering
• Feature — Predicting Solder Paste Transfer Efficiency and Print Volume
• Feature — Voiding Control at High-Power Die-Attach Preform Soldering
• Supply Lines Highlights
• Feature — Vapor Degreasing Chemistries to Remove Difficult Lead-Free and No-Clean Fluxes from PCBs
• Short — Real Time with…IPC: OK International Brings Disruptive Technology in Hand Soldering
• EIN Market Highlights
• Column — Solutions for Long-term Storage of Electronic Components and Compositions
• Short — Real Time with…IPC: Tim O'Neill Discusses Latest Developments in Lead-Free Soldering Market
• Interview — Virtex on Military & Aerospace Electronics Requirements
• Top Ten Recent Highlights from SMT007
• Events Calendar
• Advertiser Index
• Untitled