Issue link: https://iconnect007.uberflip.com/i/806706
June 6-8, 2017 Edward Village Markham, ON, Canada International Conference on Soldering & Reliability CONFERENCE OVERVIEW Starting in 2017 the scope of the conference will be broadened to include the physical design aspects relating to electronics component, product and system reliability, involving such topics as thermal and mechanical design, design for manufacturability, test and signal integrity. KEYNOTE PRESENTATIONS Nanotechnology in Electronics Packaging Interconnect, and Assembly: Hype or Reality? Chuck Bauer, Ph.D., TechLead Corporation The Importance of Design to Improve Manufacturing Process Yield and Reliability Jasbir Bath, Bath Consultancy LLC SESSION TOPICS Solder R&D and Applications Solder Joint Reliability Future Trends and Technologies Contamination and Cleanliness Testing Failure Modes and Mitigation Reliability Defect Detection Bottom Termination Component Design Panel SUPPORTING PARTNERS: MEDIA PARTNERS: Workshops | June 6 Conference | June 7-8 Toronto Chapter Expo & Tech Forum | June 7 FOR MORE INFORMATION: WWW.SMTA.ORG/ICSR