PCB007 Magazine


Issue link: https://iconnect007.uberflip.com/i/819981

Contents of this Issue


Page 107 of 111

108 The PCB Magazine • May 2017 1 Flex Talk: Flex Material Handling—An Inside Peek As increasingly more designs move to flexible materials to take advantage of space, weight or packaging benefits, it has been clear that flexible circuits require a different set of rules than their rigid counterparts. We spend substantial time working through the design to ensure that flex is as robust as possible. 2 A Conversation with Gene Weiner In a discussion following the PCB Executive Forum at IPC APEX EXPO in February, Gene Weiner opened up to Barry Matties and Patty Goldman on the state of the North Amer- ican electronics industry sup- ply chain and the importance of cooperative efforts up and down that supply chain. 3 American Standard Circuits Discusses e-Book on Designing Flex and Rigid-Flex American Standard Circuits is an industry leader when it comes to high-technol- ogy printed circuit boards, especially flex and rigid-flex printed circuit boards. So, it was natural that they would write about flex and rigid- flex for I-Connect007's new "Guide to…" e-book series. 4 All About Flex: Flex Circuit Stiffeners Many flexible circuit designs require selectively bonded stiffeners…they're just too flexible! Stiffener materials can be any number of materials, but they are usually polyimide films or FR-4 glass/epoxy sub- strates and are available in a wide variety of thicknesses. TOP TEN Recent Highlights from PCB007

Articles in this issue

Links on this page

Archives of this issue

view archives of PCB007 Magazine - PCB-May2017