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44 The PCB Magazine • June 2017 test methods will be established, as this has to do with the way to manufacture cost-effective products that are operated at high tempera- tures. The important factor is that PCB material is the first selected based on facts. In addition, global safety standards must be fulfilled. An additional BMBF PCB 4.0 [6] (Figure 15) is targeted to the electronics that is needed for Industry 4.0. In this project, machines will talk to machines. The computer will take this input data and will analyse and store this information for future traceability. This is a requirement of the industry that must be fulfilled as the require- ments and the implementation of Industry 4.0. The need for documentation and sharing of process data with the customers in the supply chain is the objective. This will be done with a new interfaces technology and sensor technics. This device must be reliable and highly flexible in terms of robustness against all kinds of en- vironmental impacts like temperatures, vibra- tion and mechanical shock, humidity, gases, solvents, light and others. The device embed- ding technology is an effective way of consider- ing this to provide effective industry solutions. As the fabricators in Europe very much depend on innovation in conjunction with miniatur- ization, the BMBF 4.0 project is mandatory for future industry systems and robotics. Product and Process Developments: Device Embedding and Application Technology Embedding devices are mainly regarded as placing active and or passive components in- side a PCB. However, processed digital or ana- logue signals will not stay forever inside the specific PCB. An interphase is needed to con- nect the data to the outside world. This can be wireless with Bluetooth, NFC or WLAN or other standard interphases like USB, Thunderbolt or any other connector-based technology. Now there is a way to integrate the connec- tor as a part of the technology of the embedded device that is used inside the PCB (Figure 16). The process is done simultaneously with em- bedding the other SMT devices. In the racing car, weight saving and im- proved functionality are key elements for a high chance to be first in class. The device em- bedding technology, using the AML technology EMBEDDING ACTIVE AND PASSIVE COMPONENTS IN ORGANIC PCBS Figure 15: Sensor technology for Industry 4.0 using embedding technology to enable automatic data collection and sharing.