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July 2017 • SMT Magazine 73 THERMAL INDICATOR TECHNOLOGY FOR AEROSPACE WIRE HARNESS ASSEMBLIES tion colors which are giving users many more color options. The color options are a func- tion of the dyes' temperature activation ranges and therefore cannot be randomly selected to fit a user's desired color change pallet. The user should contact the solder preform provider to determine the available color options for their solder melting range. In some instances, multi- ple color activation ranges are available at the same transition range providing a wider selec- tion of color options. Fuse alloy rings integrated into the sol- der sleeve are another type of thermal indica- tor used in the aerospace industry. The fuse al- loy ring is integrated with the solder sleeve and used as the visual indicator to the opera- tor or quality inspector. The solder sleeve and fuse alloy rings are made from different alloys. A solder ring of a higher melt point alloy is fit- ted over the outside circumference of the base alloy sleeve. The solder ring's melt temperature range is a spec- ified set temperature above the base solder sleeve alloy. When the solder ring melts, the base sleeve alloy has melted properly and the solder joint forms. The fuse alloy ring can be dialed into any temperature range but are most commonly used with SnAg and SnPb alloys. Thermal indicator technologies used with solder preforms are an effective means for de- termining a cable interconnection has been soldered correctly. They provide a visual indi- cation to the operator and quality control in- spector that adequate soldering temperatures have been reached. Thermal indicators provide a more accurate and visual verification of the solder joint than using a photo or sketch as a gauge for inspection. Recent advancements in thermal dye indicator technology are providing a more durable coating and brilliant color selec- tions. SMT Jerry Sidone is Alpha's Engineered Materials Product Manager for all the Americas and European regions. Wire harness assemblies for aerospace applications. University of Queensland researchers have partnered with Lockheed Martin to develop next generation computers for aerospace applications. ARC Future Fellow and project lead Professor Warwick Bowen said the partnership would develop a new approach to computer technology, with the potential for future commercial impacts in the aerospace industry. UQ made a recent multi-million-dollar invest- ment in nanofabrication tools capable of build- ing devices with features only a few tens of atoms in size. The project is part of the University of Queensland Precision Sensing Initiative, a joint initiative of the Schools of Mathematics and Phys- ics and of Information Technology and Electrical Engineering. UQ Partners with Lockheed Martin to Develop Next-Gen Computers for Aerospace Applications

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