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74 SMT Magazine • July 2017 RTW NEPCON CHINA: Mycronic Meets High- volume Demand with Solder Jet Printing Mycronic VP for Global Dispensing and Managing Director Clemens Jargon discusses how the flexibil- ity of solder jet printing helps reduce downtime in the line, thus increasing total line speed and en- abling it to keep up with high-volume demand. Business and Technical Developments at Super Dry Totech At the recent SMT Hybrid Packaging show in Nuremberg, Germany, I-Connect007 Technical Edi - tor Pete Starkey visits Super Dry Totech and spends a few minutes with CEO Jos Brehler and Sales Man- ager Terry Morgan to talk about the rationale be- hind ASYS Group's acquisition of stake in Super Dry T otech, as well as the latest technology develop- ments happening at the company. Nordson Showcases Test and Inspection Systems at SEMICON West Nordson DAGE and Nordson YESTECH, divisions of Nordson Corporation (NASDAQ: NDSN), an - nounce plans to exhibit in Booth #5644 at SEMI- CON West, scheduled to take place July 11-13, 2017 at the Moscone Center in San Francisco, Cal- ifornia. Lord Adds Ellsworth Adhesives to Its Electronic Materials Distribution Team Lord Corp. has announced that Ellsworth Adhesives will now sell its electronic materials product line. Zestron Technical Workshop Tackles Next Generation of Cleaning Zestron recently held a technical workshop in Ala - bang, Muntinlupa City in the Philippines to help us- ers address their cleaning challenges amid advance- ments in semiconductor device packaging. Electrolube India Awarded ISO 9001-2015 Certificate Electrolube India has received one of the world's most recognized standards, the ISO 9001-2015. This standard is based upon verification of a num- ber of quality management principles demonstrat- ed by an organization. ISO 9001-2015 requires a strong customer focus and a culture of continual improvement. VJ Electronix to Relocate Facility to Chelmsford, Massachusetts VJ Electronix Inc. has announced that effective July 1, the company is moving to a new facility in Chelmsford, Massachusetts. The new centrally lo- cated building is approximately 10 miles north of the existing Littleton facility. Indium's Bernard Leavitt to Present at IMAPS HiTEN 2017 Indium Corporation's Bernard Leavitt, Product Spe - cialist, High-Temperature Applications, will present at IMAPS High Temperature Electronics Network 2017 (HiTEN 2017), July 10-12 in Cambridge, United Kingdom. RTW NEPCON CHINA: Teknek Discusses Contact Cleaning Technology Trends Stephen Mitchell, managing director of Teknek, a contact cleaning solutions provider, discusses the latest trends in contact cleaning technology. He provides his outlook on China's electronics man - ufacturing industry and intelligent manufacturing, and talks about how Teknek's contact cleaning sys- tems are helping customers address their defects and productivity issues. Alpha to Highlight New Material Set Combinations at SMTA Ohio Expo & Tech Forum Alpha Assembly Solutions will feature its new mate- rial set combinations at the upcoming SMTA Ohio Expo and Tech Forum to be held on July 13, 2017 at the Embassy Suites Cleveland-Rockside in Inde- pendence, Ohio. Supply Lines Highlights

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