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102 SMT Magazine • July 2017 new design rules and alternative manufacturing protocols. It is anticipated that similar compo- nent related impacts will be realized as lead-free solder technology implementation in harsh en- vironment electronic conditions. Acknowledgements The authors would like to thank Ken Blazek and Tina Berthiaume, Rockwell Collins Ad- vanced Operations Engineering, for metallo- graphic cross-section processing and Ross Wil- coxon for his scathing review of the draft man- uscript. SMT References 1. IPC Market Research, "Issues and Outlook for Leadfree Electronics in Military & Aerospace Applica- tions," IPC, April 2015. 2. M. Osterman, et al., "Assessing Reliability of Reballed Ball Grid Array Assemblies under Tempera- ture Cycling Test," SMTAI Conference Proceedings, 2009. 3. R. Coyle, et al., "Interconnection Reliability of Interposer and Reballing Options for Ball Grid Array Backward Compatibility," SMTAI Conference Pro- ceedings, 2012. 4. D. Hillman, et al., "Last Will and Testaments of Tin/Lead and Lead-free BGA Voids," IPC APEX Con- ference, February, 2013. 5. P. Snugovsky, et al., "Microstructure, Defects, and Reliability of Mixed Pb-free/SnPb Assemblies," Proceedings TMS, V1: Materials Processing and Prop- erties, p. 631-642, 2008. 6. R. Coyle, et al, "A Comprehensive Analysis of the Thermal Fatigue Reliability of SnPb and Pb Free Plastic Ball Grid Arrays (PBGA) Using Backward and Forward Compatible Assembly Processes," Journal of SMT, Volume 21 Issue 4, pp. 33-47, 2008. 7. D. Nelson, et al., "Manufacturing and Reliabil- ity of Pb-Free and Mixed System Assemblies (SnPb/ Pb- Free) in Avionics Environments," Journal of SMT, Volume 17 Issue 1, pp. 17-24, 2004. 8. D. Hillman, et al., "ECMP Ball Grid Array (BGA) Package Qualification Program," Rockwell Collins In- ternal Working Paper WP14-2026, 2014. 9. D. Hillman, et al., "The Impact of Reflowing a Pb-free Solder Alloy Using a Tin/Lead Solder Alloy Re- flow Profile on Solder Joint Integrity," CMAP Interna- tional Conference on Lead-free Soldering, May, 2005. 10. D. Hillman and R. Wilcoxon, "JCAA/JGPP No- Lead Solder Project, -55°C to +125°C Thermal Cycle Testing Final Report," Contract GST 0504BM3419, ITB Inc, March 2006. 11. National Center for Manufacturing Scienc- USING LEAD-FREE BGAs IN A TIN/LEAD SOLDERING PROCESS es Report, Pb-free Solder Project, NCMS 0401RE96, 1997. 12. J. Bath, et al., "Lead-free Pin Through Hole Reliability," Solectron Internal Report, 2006. 13. P. Snugovsky, Z. Bagheri, M. Romansky, Whis- ker, "Growth on SAC Solder Joints: Microstructure Analysis," SMTA International Conference on Solder- ing and Reliability, Toronto, Ontario, Canada, May 14-15, 2008. 14. D. Hillman, "The Role of Ionic Contamina- tion as a Tin Whisker Initiator," IPC/SMTA Cleaning & Conformal Coating Conference, 2010. 15. J. Osenbach, J. DeLucca, B. Potteiger, A. Amin, R. L. Shook, and F. A. Baiocchi, "Sn Corrosion and Its Influence on Whisker Growth," IEEE Trans. Electron- ics Packaging Manufacturing Vol. 30, 2007, pp. 23. 16. S. Meschter, et al., "Strategic Environmen- tal Research and Development Program (SERDP) Tin Whisker Testing and Modeling: Thermal Cycling Testing," Journal of SMTA, Vol. 28, Issue 2, 2015. 17. P. Xue et al., "Effect of Pr on properties and Sn whisker Growth of Sn-9Zn-xPr solder," Soldering & Surface Mount Technology, Vol. 24, No. 4, 2012. 18. H. Ye et al., "Growth behaviors of tin whisker in RE-doped Sn-Zn-Ga solder," Soldering & Surface Mount Technology, Vol. 25, No. 3, 2013. 19. T. H. Chuang, S. F. Yen, "Abnormal Tin Whisker Growth in Rare Earth Element-Doped Sn3Ag0.5CuXCe Solder Joints," Materials Science Fo- rum, Vols. 539-543, pp. 4019-4024, Mar. 2007. 20. M. Liu and A. Xian, "Tin Whisker Growth on the Surface of Sn-0.7Cu Lead-Free Solder with a Rare Earth (Nd) Addition," Journal of Electronic Materials, Vol. 38, No. 11, 2009. 21. P. Snugovsky, et al., "Whisker Formation on SAC305 Soldered Assemblies," Journal of Metals, No- vember 2014, Volume 66, Issue 11, pp 2320-2333. 22. T. Chuang, H. Lin, And C.C Chi, "Oxidation- Induced Whisker Growth on the Surface of Sn-6.6(La, Ce) Alloy," Journal of Electronic Materials, Vol. 36, No. 12, 2007. 23. M.A. Dudek and N. Chawla, "Oxidation Be- havior of Rare-Earth-Containing Pb-Free Solders," Journal of Electronic Materials, Vol. 38, No. 2, 2009. Editor's Note: This paper was originally published in the proceedings of SMTA International, 2016. David Hillman is materials and process engineer and a Fellow at Rockwell Collins.