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San Jose, California, USA October 24-26, 2017 2017 Sponsors Gold October 24-25, 2017 - Exhibition - Panel Discussions - Interactive Poster Sessions - Technical Presentations: - 3D - WLP - Advanced Integrated Systems and Devices - Advanced Wafer-Level Manufacturing and Test October 26, 2017 Workshops Event Schedule Packaging without the Package A More Holistic Moore's Law Subramanian Iyer, Ph.D. Distinguished Chancellor's Professor University of California, Los Angeles Keynote Presentations Silver Exhibits & Sponsorships For available opportunities, please visit www.iwlpc.com Conference Questions: Jenny Ng jenny@smta.org Platinum Exhibit & Sponsorships: Kim Newman knewman@chipscalereview.com www.iwlpc.com 2017 14 th International Wafer-Level Packaging Conference Samsung's FOPLP: Beyond Moore Richard (Kwang Wook) Bae Vice President, Corporate Strategy & Planning Samsung Electro-Mechanics Innovative Packaging Technologies Usher in a New Era for Integration Solutions Han Byung Joon, Ph.D. Chief Executive Officer STATS ChipPAC Silicon to Systems Media Sponsors Industry Sponsor