Issue link: https://iconnect007.uberflip.com/i/855901
6 SMT Magazine • August 2017 SHORTS Soft and Stretchy Fabric-Based Sensors for Wearable Robots New 3-D Chip Combines Computing and Data Storage I-Connect007 Survey on Process Step Elimination: Percentage of Total Cycle Time Spent on Final Inspection Acousto-Optic Devices: Finding New Horizons I-Connect007 Survey on Process Step Elimination: Factors to Improve Productivity DEPARTMENTS Career Opportunities Events Calendar Advertiser Index & Masthead ARTICLES Process Step Elimination: Driven by Cost and Efficiency, Enabled by Process and Materials Innovation by Westin Bent Verification of Inspection Results: Local, Central, Global? by Jens Kokott Soldering Fumes in Electronics Manufacturing: Damaging Effects and Solutions for Removal by Stefan Meissner and Arne Neiser Cleaning that Matters Interview with James Yeoh COLUMNS Assembly Training and Education by Stephen Las Marias The Role of Bismuth (Bi) in Electronics: A Prelude by Dr. Jennie S. Hwang Analyzing the Cost of Material in Today's Global Economy, Part 3 by Tom Borkes HIGHLIGHTS MilAero007 Supply Lines Markets Top Ten Highlights from SMT007 50 56 64 70 8 12 24 40 48 62 84 15 22 30 54 60 76 86 87 64 50 56 August 2017 • More Content M A G A Z I N E