SMT007 Magazine

Click our video for more: ©2017 Indium Corporation Typical Voiding >40% Void Area Indium8.9HF <15% Void Area Contact our engineers today: techsupport@indium.com Learn more: www.indium.com/avoidthevoid/SMTUS Indium8.9HF Solder Paste Halogen-Free, No-Clean Best-in-class response-to-pause print performance and definition with low variation Exceptional printing and reflow after room temperature storage for 30 days High oxidation resistance allowing exceptional wetting to oxidized BGA and pad surfaces Restricted flux residue Eliminates hot and cold slump

• Cover
• Featured Content — Assembly Training and Education
• More Content
• Column — Assembly Training and Education
• Column — The Role of Bismuth (Bi) in Electronics: A Prelude
• Short — Soft and Stretchy Fabric-Based Sensors for Wearable Robots
• Feature — Training and Education: Key to Improving Electronics Assembly
• Short — New 3-D Chip Combines Computing and Data Storage
• Column — Analyzing the Cost of Material in Today's Global Economy, Part 3
• Short — I-Connect007 Survey on Process Step Elimination: Cycle Time Spent on Final Inspection
• Feature — Empowering the Workforce Through Training: An Investment Return
• MilAero007 Highlights
• Feature — The EMS Skills Gap Epidemic
• Supply Lines Highlights
• Article — Process Step Elimination: Driven by Cost and Efficiency, Enabled by Process and Materials Innovation
• Short — Acousto-Optic Devices: Finding New Horizons
• Article — Verification of Inspection Results: Local, Central, Global?
• Short — I-Connect007 Survey on Process Step Elimination: What is More Important for Productivity?
• EIN Market Highlights
• Article — Soldering Fumes in Electronics Manufacturing: Damaging Effects and Solutions for Removal
• Interview — Cleaning that Matters
• Career Opportunities Section
• Top Ten Recent Highlights from SMT007
• Events Calendar
• Advertiser Index and Masthead