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62 SMT Magazine • October 2017 the industry for almost 25 years, and I think the voids have always been there. It's just that it's getting magnified now as the components are getting hot. Las Marias: Do you think voiding can still be pushed down to the low single digits? Sjoberg: For some applications, yes. But I don't feel comfortable, as an engineer, to promise a customer less than 20%, overall. For some ap- plications, it will be below 10%. You will see our marketing information, like for the 8.9HF and 10.1HF, at below 10%. That's for certain appli- cations. Las Marias: How do you help your customers solve their voiding issues? Sjoberg: First, give them the right paste. Of course, our product information will give a rec- ommendation on what printer set-up to use and reflow profile to use, but in many cases, we typically do a technical seminar with the cus- tomer before they start using the material. You can give everyone something in writing, but it's much more valuable to explain it face to face. So, we always try to give technical seminar to the customer before they do their evaluation. Some customers don't allow that as they want to do it by themselves, so then we give them our recommended process parameters. There's certain parameters to reduce voiding. For instance, with our 8.9HF, longer time above liquidus completely reduces voiding—but that doesn't help with all the materials. Some mate- rials might get worse, but most of our materials, ADDRESSING VOIDS TO ACHIEVE GOOD SOLDER JOINTS Jonas Sigfrid Sjoberg

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