64 SMT Magazine • October 2017
Rehm Rigorously Inspects Electronics
Components
Rehm relies on the new YXLON Cheetah μHD with
3D computer tomography (CT) for components
analysis.
Cogiscan Signs Maxnerva Technology
as Partner in Greater China
Cogiscan Inc. has announced a new business part-
nership with Maxnerva Technology Services Ltd as
its sales and distribution partner in Greater China.
Trenton Technology Upgrades to
3D AOI from Nordson YESTECH
Trenton Technology has installed two of Nordson
YESTECH's FX-940 ULTRA 3D AOI systems at its Uti-
ca, New York facility.
Vision Engineering Founder Rob Freeman
Passes Away
Vision Engineering Ltd announces the loss of found-
er Rob Freeman, MBE, who passed away on August
19, at age 84.
AIM's Flopy Feng Receives Best
Presentation Award at the SMTA
China South Technology Conference
AIM Solder is pleased to announce that Flopy Feng,
technical support engineer, received the award
for Best Presentation in his technical session at
the SMTA China South Technology Conference in
Shenzhen, China.
Heraeus Selects ASM's Mid-Speed
Placement Platform for State-of-the-Art
SMT Applications Lab
Heraeus has selected ASM Assembly Systems' E
by SIPLACE mid-speed placement platform to en-
hance customer support and benchmarking initia-
tives within its new Pennsylvania-based state-of-
the-art SMT Applications Lab.
SMART Group Launches Guide to
QFN/LGA & BTC Process Defects
SMART Group's latest Process Defect Photo Guide,
"Guide to QFN/LGA & BTC Process Defects," will
be released on October 16.
Nordson VP Robert Veillette to Retire
Nordson Corporation's Vice President, General
Counsel and Secretary Robert E. Veillette will retire
from the company after 32 years of service, effec-
tive December 31, 2017.
MIRTEC Europe Receives 2017 EM Best
of Industry Award for AOI
MIRTEC is the recipient of the 2017 Electronics
Maker Best of Industry Award in the category of
"Manufacturing Excellence in Automated Optical
Inspection (AOI)."
RTW NEPCON South China: Vermes
Discusses Piezo Technology in
Microdispensing
During the recent NEPCON South China event in
Shenzhen, Juergen Staedtler, CEO of Vermes Mi-
crodispensing GmbH, discusses their latest inno-
vations in microdispensing, and how their piezo
technology is addressing the trend towards minia-
turization in PCB assemblies.
Supply Lines
Highlights
