Issue link: https://iconnect007.uberflip.com/i/881969
October 2017 • SMT Magazine 77 RELIABILITY OF ENEPIG BY SEQUENTIAL THERMAL CYCLING AND AGING Figure 11: Representative SEM photomicrograph images of LGA1156 solder conditions under the die and over the via after 200 thermal cycles (-55°C/+125°C) and an additional 100 thermal shock cycles (-65°C/+150°C). Figure 10: A representative thermal shock cycle profile (-65°C/+150°C).