Design007 Magazine

Design007-Jan2018

Issue link: https://iconnect007.uberflip.com/i/929192

Contents of this Issue

Navigation

Page 105 of 121

106 DESIGN007 MAGAZINE I JANUARY 2018 1 Top 10 Most-Read PCB Design Articles of 2017 E On New Year's Day, we took a look back at the most-read PCB design articles of 2017. Here are the top 10 design articles of the last year for your enjoyment. Is it just a coincidence that two of these articles are related to HDI design techniques? 2 That's Hot: Ventec's Goodwin on Thermal Management E IPC's fall committee meetings were held in conjunction with SMTA International, as has been the case for several years now. Patty Goldman sat in on some subcom- mittee meetings, including one on laminates, where she met up with Ventec COO Mark Goodwin for a discussion on thermal manage- ment from a laminate supplier's perspective. 3 Cadence Allegro Pulse Extends Team Collaboration E Cadence Design Systems has announced Cadence Allegro Pulse, the industry's first solution to enable extended team collaboration by pro- viding near-real-time insights into the com- plexities of the electronic design process. Alle- gro Pulse connects management, engineering, procurement and other business stakeholders to up-to-date work-in-progress design data in a single, unified web-based platform. 4 The Impact of HDI on PCB Power Distribution E HDI is often used to meet the requirements of today's complex designs. Smaller component pitches, larger ASICs and FPGAs with more I/O, and higher frequencies with shrinking rise-times all require smaller PCB features, driving the need for HDI. Beyond some of the more obvious electrical effects of the microvias Recent Highlights from Design007

Articles in this issue

Links on this page

Archives of this issue

view archives of Design007 Magazine - Design007-Jan2018