Design007 Magazine

Se cr ets of Hig h- Spe ed PC Bs 2

• Cover
• Featured Content — What's New?
• Additional Content
• Column — New Year, New Title, and New Look
• Short — Mysteries of a Promising Spintronic Material Revealed
• Feature — What's New in EDA: The Experts Discussion
• Short — A Major Step Forward in Organic Electronics
• Feature — IoT: Let's Put the "A" Back into EDA
• Feature — Fully Automated Schematic Verification
• Short — Developing a Secure, Un-Hackable Net
• Feature — Ucamco Focuses on Improving Gerber, CAM Automation
• Short — Researchers Develop World's Smallest Wearable Device
• Feature — Pulsonix Ready for 2018
• IPC APEX EXPO 2018 Pre-Show Coverage
• A Sneak-Peek at IPC APEX EXPO 2018
• Short — Philip Carmichael, IPC President, Asia on the Changes in PCB Value Chain
• Keeping it New, Current and Relevant: IPC Conference Director Jasbir Bath
• CFX: Updates and Developments
• All the Details on IPC's Emerging Engineer Program
• What to Expect at IPC APEX EXPO 2018: EXPO Veteran Alicia Balonek Shares
• IPC APEX EXPO App is Where It's At
• PCB007 Highlights
• Column — Ground Bounce
• Short — Nanotube Fibers in a Jiffy
• MilAero Highlights
• Column — Phase Change Materials: A Practical Addition to Thermal Management Options
• Column — Good Support Isn't Just for Customers
• Short — Going Organic
• Top 10 Recent Highlights from Design007
• Career Opportunities Section
• Events Calendar
• Advertiser Index and Masthead
• Back Cover