SMT007 Magazine

SMT-Apr2018

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26 SMT007 MAGAZINE I APRIL 2018 Siemens Addresses Digital Enterprise with Valor IoT Manufacturing Tool E Siemens today announced the Valor IoT Manu- facturing Analytics product, a new comprehen- sive big data and business intelligence platform that monitors and manages global electronics manufacturing operations for accurate, real- time manufacturing utilization and overall equipment effectiveness (OEE). RTW IPC APEX EXPO: How Smart Factories Will Revolutionize Electronics Manufacturing E KIC president Bjorn Dahle discusses the smart manufacturing trend in the electronics assembly industry, and how KIC can help their custom- ers with smart manufacturing transitions. Flextron Unveils New X-ray Inspection, Failure Analysis Capability E Flextron Circuit Assembly announces the avail- ability of 3D X-ray imaging capability, through the acquisition of a Nikon XTV-160 system that provides Flextron with a powerful quality assurance and diagnostic tool. The IoT Event of The Decade E The IPC APEX EXPO tradeshow at the end of this month is set to rock the manufacturing world in a way that has not been seen for many years. RTW IPC APEX EXPO: Indium Discusses Fighting Solder Voids E Voiding has increasingly become one of the most critical challenges in the soldering process. In this interview, Christopher Nash, product manager for the PCB assembly solder paste business of Indium, speaks about how the company is help - ing customers address the voiding challenge. Cirtronics Invests in Additional Pillarhouse Selective Soldering System E Pillarhouse is pleased to announce that Cirtron- ics has today placed an order for a 4th Pillar- house selective soldering system, for their manufacturing facility. RTW IPC APEX EXPO: Addressing Challenges in Automotive Electronics E Paul Salerno explains how Alpha Assembly Solutions have addressed the challenges of the exponential growth in automotive electronics, with specific reference to soldering in power train, ADAS, and infotainment applications. RTW IPC APEX EXPO: Developments and Reliability Improvements in Solder Alloys E Tim O'Neill of AIM Solder explains develop- ments in solder alloys for cost-sensitive appli- cations, and improvements in the reliability of alloys subjected to sustained high temperatures. RTW IPC APEX EXPO: COMET Technologies Highlights Product Range and New Facility E Craig Arcuri of COMET Technologies details the numerous ways his company's technol- ogy is employed to manufacture and inspect a wide range of products, from chips to jet engine turbine blades. He also speaks about Lab One, the company's new technology and application center in Silicon Valley. Supply Line Highlights

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