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92 I-CONNECT007 I SHOW & TELL MAGAZINE 2018 IPC Issues Call for Participation for IPC APEX EXPO 2019 IPC–Association Connecting Electronics Indus- tries invites engineers, researchers, academics, technical experts, and industry leaders to submit abstracts for IPC APEX EXPO 2019 to be held at the San Diego Convention Center. Professional development courses will take place January 27, 28, and 31, 2019. The technical conference will take place January 21–31, 2019. The industry's premier conference and exhi - bition for the electronics industry, IPC APEX EXPO, provides presenters and their companies with a notable and cost-effective opportunity to promote their expertise and gain visibility with key engineers, managers, and executives from all segments of the industry worldwide. Staff from companies such as Ericsson, Flex, IBM, Indium, MacDermid Enthone, Northrop Grum - man, Oracle, and Robert Bosch GmbH have presented papers at past technical conference sessions at IPC APEX EXPO. To recognize excep- tional achievement, awards will be presented for "Best Paper." Expert papers and presentations are being sought on design, materials, assembly, pro- cesses, test, reliability, and equipment in the following areas: An approximate 300-word technical conference abstract summarizing original and previously unpublished work covering case histories, research, and discoveries must be submitted. The submission should describe significant results from experiments and case studies, emphasize new techniques, dis- cuss trends of interest, and contain appropriate technical test results. In addition, course proposals are solicited from individuals interested in presenting half-day (three- hour) professional development courses on design, manufacturing processes, and materials. Technical conference paper abstracts and course proposals are due June 15, 2018. To submit an abstract or course proposal, visit www.IPCAPEXEXPO.org/CFP. • 3D Printing in Electronics Manufacturing • Automation in Electronics Manufacturing • Adhesives • Advanced Technology • Area Array/Flip Chip/0201 Metric • Assembly and Rework Processes • BGA/CSP Packaging • Black Pad and Other Board Related Defect Issues • BTC/QFN/LGA Components • Business & Supply Chain Issues • Cleaning • Conformal Coatings • Corrosion • Counterfeit Electronics • Design • Electromigration • Electronics Manufacturing Services • Embedded Passive & Active Devices • Environmental Compliance • Graphene in Electronics Manufacturing • Lean Six Sigma • LED Manufacturing • Failure Analysis • Flexible Circuitry • HDI Technologies • Head-on-Pillow • Board and Component Warpage • High Speed, High Frequency & Signal • Industry 4.0 • Integrity • Lead-Free Fabrication, Assembly & Reliability • Miniaturization Nanotechnology Optoelectronics • Packaging & Components • PCB Fabrication • PCB and Component Storage & Handling Performance • Quality & Reliability • Photovoltaics • PoP (Package-on-Package) • Printed Electronics • Reshoring • RFID Circuitry • Robotics • Soldering • Surface Finishes • Test, Inspection & AOI • Tin Whiskers • 2.5-D/3-D Component Packaging • Underfills • Via Plugging & Other Protection • Wearables