PCB007 Magazine


Issue link: https://iconnect007.uberflip.com/i/978458

Contents of this Issue


Page 52 of 97

ENEPIG "2.0" Uniquely flexible and stable electrolytes, with Talon electroless /alloyed palladium phos Lowest make-up and operating costs Pure palladium formulation available Reduction-assisted TWX-40 plates up to 8 µin of gold, with no nickel corrosion or deposit porosity North America's Leading Experts in Final Finishes, Via Fills, Acid and Electroless Coppers, Immersion Silver and Tin; also MEC Surface Trea tments and Auruna Gold Electrolytes. Corporate Headquarters: 3990 Concours, #425 • Ontario, CA 91764 • ph: (909) 466-5635 Tech Center: 240 Town Line Road • Southington, CT 06489 • ph: (860) 793-4011 USA www.uyemura.com ENEPIG has (at last!) reached its ultimate performance potential!

Articles in this issue

Links on this page

Archives of this issue

view archives of PCB007 Magazine - PCB-May2018